top of page

Insights

Projects

Project1

Project3

Project2

Blog

Topic1

Topic2

Topic3

Events

Workshops

Exhibitions

Services

Product Development

Assay Development

Design & Simulation

Back-end Services

Material Development

Surface Functionalization

Rapid Prototyping

Product Manufacturing

Process Development

Pilot Manufacturing

Serial manufacturing

OEM Platforms

GenSpeed

BiFlow

Technical Consulting

Design for Manufacturing

Feasability

Technical consulting

Platin

Gold

Standard

Technologies

Assay

Esrte Seite 

Zweite Seite

Dritte Seite

Material

Flexible Plastic

Plastic

Glass

Electrodes & Sensors

Optical

Chemical

Thermal

Surface Functionalization

Erste Seite

Zweite Seite

Dritte Seite

Soft Lithography

Wet Etching

Roll to Plate

Laser Ablation

Back-end Processes

Bonding

Singulation

Packaging

Technologies

Insights

Ressources

Contact

Wet Etching: Crafting Complex Patterns in Microfluidic Chips

Wet etching is a foundational manufacturing technique used to etch precise patterns into substrates like glass and silicon, crucial for microfluidic chip production. This process involves the controlled application of chemical solutions, such as hydrofluoric acid (HF) for glass and alkali hydroxides like KOH or TMAH for silicon. These chemicals meticulously remove material, following patterns defined by photolithography, to create intricate channels and structures. Wet etching can be isotropic, affecting the substrate uniformly across all directions, or anisotropic, leveraging silicon's crystalline structure to etch specific geometries and angles.

Isotropic Etching

Isotropic Etching is a uniform etching process that removes material equally in all directions. This method results in smooth, rounded contours and is often used when precision depth control and surface quality are paramount. It's particularly suited for etching glass, where the etchant, like hydrofluoric acid (HF), dissolves material uniformly, creating channels and features with rounded edges.

Anisotropic Etching

Anisotropic Etching, on the other hand, etches material at different rates in different directions, allowing for more precise control over the shape and profile of the etched features. This technique is commonly applied to silicon substrates using alkaline chemicals like potassium hydroxide (KOH). Anisotropic etching exploits the crystalline structure of silicon to achieve precise geometrical patterns, angles, and high aspect ratio features, making it ideal for complex microfabrication tasks that require sharp, well-defined edges and intricate patterns.

Wet Etching

Maximise the potential of your microfluidic device with a strategic design-for-manufacturing approach tailored specifically for wet etching processes. Our service focuses on refining your designs to fit seamlessly with the nuances of wet etching, ensuring your prototypes are ready for efficient, high-precision production lines.

Design for Manufacturing

Microfluidic chip manufactured with wet etching by micronit, a microfluidic innovation hub member.

Achieves sub-micrometer to micrometer feature sizes, enabling the creation of highly detailed microfluidic channels and structures with precise positioning.

High Precision

Suitable for a wide array of materials including glass, silicon, and various thin film metals, offering comprehensive solutions for diverse microfabrication needs.

Material Versatility

Ensures smooth, isotropic or anisotropic surfaces depending on the etching process, enhancing device performance and fluid flow characteristics.

Smooth Surface Quality