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Microfluidic Chip Bonding Techniques at MIH

Explore the pinnacle of innovation in microfluidic device fabrication with our state-of-the-art bonding technologies. Designed for the most demanding applications in the biological, pharmaceutical, and medical fields, our solutions prioritize biocompatibility and precision. Our range of bonding techniques, including adhesive, thermal fusion, solvent assisted, plasma assisted, and welding, ensures optimal functionality and material integrity for every application.

Advanced Bonding Technologies for Microfluidic Devices

Welding (Ultrasonic and Laser)

Image showing Ultrasonic welding steps for material bonding on example of GenSpeed Microfluidic Chip - Gen Speed is partner at Microlfuidics Innovation Hub.

Welding uses localized application of energy to bond materials, with ultrasonic utilizing high-frequency vibrations and laser using focused light.

Best suited for robust, industrial-scale applications requiring precise, hermetic sealing.

Key Features:

  • Precision Bonding: Both methods allow precise control over the bonding area, minimizing impact on surrounding areas.

  • Rapid Process: Especially ultrasonic welding, which can complete bonds in seconds.

Plasma Assisted Bonding

Foto of Scientist in front of computer finalizing settings for plasma assisted material bonding for microfluidics.

Utilizes low-pressure plasma to activate the substrate surface, enhancing its adhesion potential, followed by thermal fusion bonding.

Key Features:

  • Surface Activation: Plasma creates a highly reactive surface for improved bonding strength.

  • Eco-Friendly Process: No use of chemical additives, minimizing contamination risks.

Solvent Assisted Bonding

Foto of chemical solvents for solvent assisted material bonding.

Involves treating the substrate with a solvent to slightly dissolve the surface, preparing it for bonding under light heat and pressure.

Key Features:

  • Low-Temperature Process: Typically around 40°C, suitable for heat-sensitive applications.

  • Minimal Residual Solvent: Designed to evaporate during bonding, leaving minimal residues.

Thermal Fusion Bonding

Microscope image of microfluidic chip bonding by inmold: left after thermal fusion bonding, right before themral fusion bonidng  - inmold is member at Microfluidics Innovation hub.

This method directly bonds polymer substrates by applying heat and pressure until the material softens and fuses together.

Key Features:

  • No Additional Materials: Ensures a clean bonding process with only the substrate material involved.

  • Controlled Heat Application: Critical to avoid deformation of microstructures within the substrate.

Adhesive Bonding

Foto of glue for adhesive bonding technique for microfluidic chip bonding.

Adhesive bonding uses a substance added between substrates to connect them, such as tape or glue, offering flexibility in application.

Key Features:

  • Variety of Tapes and Glues: Can choose from biofriendly variants to enhance biocompatibility.

  • Tailored Thickness: Adhesive layers can be customized in thickness for different bonding strength needs.

  • UV Curable Adhesives: Offers controlled curing via UV light, avoiding the need for high temperatures.

Contact us today and together we will evaluate which manufacturing process best suits your microfluidic needs! 

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